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Er-Ping Li

Жанры и тэги:

технические наукитехническая литератураэлектроника
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Electrical Modeling and Design for 3D System Integration. 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
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Electrical Modeling and Design for 3D System Integration. 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
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New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's exte…
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Electrical Modeling and Design for 3D System Integration. 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
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Electrical Modeling and Design for 3D System Integration. 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
0
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's exte…
Подробнее
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