Peter Ramm

Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the i…

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary…

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective …