Peter Ramm

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective …

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary…

Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the i…