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Liu Sheng

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Modeling and Simulation for Microelectronic Packaging Assembly. Manufacturing, Reliability and Testing
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests ar…
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Modeling and Simulation for Microelectronic Packaging Assembly. Manufacturing, Reliability and Testing
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests ar…
Подробнее
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