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Tzyy-Sheng Jason Horng

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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
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An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments…
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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
0
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments…
Подробнее
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